STYCAST US 1150
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Convenient 1:4 Meter-Mix Ratio
- Extended 60-Minute Working Time
- Low-Temperature Hardness Stability
Product Description
LOCTITE STYCAST US 1150 is a two-component, mineral-filled polyurethane encapsulant and sealant for protecting electronics and devices from environmental hazards. The system mixes at 1:4 by volume or 21:100 by weight and has a typical mixed viscosity of 3,500 cP at 25 deg C. A 140 g mass provides 60 minutes of working time, followed by a recommended 24-to-48-hour cure at 25 deg C. The cured black material has Shore A60 hardness, a -60 deg C glass transition temperature, 0.486 W/(m K) thermal conductivity, and 950 V/mil dielectric strength for telecommunications and automotive device potting.
Key features
- Convenient meter-mix ratio: The 1:4 volume ratio is suited to meter-mix dispensing.
- Sixty-minute working time: A 140 g mass provides 60 minutes of working time.
- Low-temperature hardness stability: The material exhibits very little hardness increase when cooled to -75 deg C.
Applications
Potting and encapsulation of electronic, telecommunications, and automotive devices for environmental protection.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Values are typical product-selection data and are not specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Density | 1.21 | g/cm^3 | Part A; 25 deg C; typical |
| Viscosity | 90 | cP | Part A; 25 deg C; Brookfield RVF, spindle 2 at 20 rpm; typical |
| Density | 1.46 | g/cm^3 | Part B; 25 deg C; typical |
| Viscosity | 13,000 | cP | Part B; 25 deg C; Brookfield RVF, spindle 2 at 20 rpm; typical |
| Mix ratio | 1:4 | Part A:Part B; by volume | |
| Mix ratio | 21:100 | Part A:Part B; by weight | |
| Mixed viscosity | 3,500 | cP | 25 deg C; Brookfield RVF, spindle 2 at 20 rpm; typical |
| Working time | 60 | min | 140 g mass; typical |
After-processing / final-state properties
Values describe the cured material and are typical product-selection data, not specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Hardness | 60 | Shore A | Cured material; typical |
| Moisture absorption | Less than 0.2 | % | 24 h; cured material; typical |
| Glass transition temperature | -60 | deg C | Cured material; typical |
| Thermal conductivity | 0.486 | W/(m K) | Cured material; typical |
| Dielectric strength | 950 | V/mil | 20 mil thickness; cured material; typical |
| Volume resistivity | 2.96 x 10^13 | ohm-cm | 25 deg C; cured material; typical |
