LOCTITE EA 3985

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LOCTITE EA 3985

Main features

  • Fast Heat-Cure Production Bonding
  • Non-Sag Wire-to-Armature Application
  • One-Part No-Mix Processing

Product Description

LOCTITE EA 3985 is a one-component, non-sag epoxy adhesive for fast heat-cure production bonding. Its rheology limits flow away from wire windings while still allowing penetration around the wires, making it well suited to bonding wires to armatures. The product requires no component mixing and uses a normal cure cycle of 45 minutes at 121 deg C, with an alternate 30-minute cycle at 149 deg C. The cured epoxy also provides electrical insulation properties for the bonded assembly.

Key features

  • One-part application: Single-component format requires no resin-to-hardener mixing before dispensing.
  • Non-sag wire bonding: Rheology limits run-off from windings while allowing penetration around wires.
  • Fast heat cure: Heat-cure cycles include 45 minutes at 121 deg C and 30 minutes at 149 deg C.

Applications

Applications include bonding wires to armatures in heat-cure industrial assembly processes.

Technical Specifications

General Properties
Appearance
Black paste
Chemistry Type
Epoxy
Specific Gravity
1.23 to 1.28
Physical Properties
Viscosity
40,000 to 50,000 mPa.s
Electrical Properties
Volume Resistivity
31×10¹⁵ Ohms⋅cm
Other Properties
Storage Temperature
2 °C to 8 °C

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
Specific gravity1.23 to 1.28LMS range; 25 deg C
Viscosity40,000 to 50,000mPa sLMS range; Brookfield RVT; 25 deg C; spindle 7; 20 rpm
Gel time10minTypical; 121 deg C; 10 g mass
Normal cure cycle45minTypical curing performance; 121 deg C
Alternate cure cycle30minTypical curing performance; 149 deg C
Technical properties

Cured / final-state properties

PropertyValueUnitMethod / condition
Dielectric breakdown strength20.9kV/mmTypical; IEC 60243-1
Dielectric constant3.6Typical; IEC 60250; 1 kHz
Dissipation factor0.005Typical; IEC 60250; 1 kHz
Dielectric constant3.5Typical; IEC 60250; 100 kHz
Dissipation factor0.013Typical; IEC 60250; 100 kHz

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