LOCTITE 3612

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LOCTITE 3612

Main features

  • Stencil-Print SMD Placement
  • UV-Fluorescent Deposit Inspection
  • High-Profile Wet Stability

Product Description

LOCTITE 3612 is formulated as a one-part yellow epoxy surface-mount adhesive for stencil printing and heat cure. It combines very high wet strength with a high dot profile for SMD placement before wave soldering, and its positive UV fluorescence assists deposit inspection. At 150 deg C, typical cure requires 90 to 120 seconds after the adhesive reaches temperature. The uncured material has a 350 to 725 Pa yield point and 15 to 55 Pa s Casson viscosity at 25 deg C. Applications include medium-speed stencil printing for SMD-to-PCB bonding and small-parts assembly.

Key features

  • Stencil-Print Process Fit: The rheology is suited to medium-speed stencil printing with a high dot profile.
  • UV-Fluorescent Inspection: Positive fluorescence under UV light provides a visible deposit-inspection characteristic.
  • High Wet Placement Strength: Very high wet strength supports the stated SMD placement process before cure.

Applications

Medium-speed stencil-print bonding of SMD components to printed circuit boards before wave soldering and supported small-parts assembly.

Product Family

LOCTITE 3612

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Yellow viscous liquid
Chemistry Type
Epoxy
Density (g)
1.4 g/cm3
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.36
Other Properties
Storage Temperature
2 °C to 8 °C
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
155 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.3 W/m.K
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.8×10¹⁵ Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
AppearanceYellow viscous liquidUncured; typical
UV fluorescencePositiveUncured material under UV light
Specific gravity1.36DimensionlessTypical at 25 deg C
Yield point350 to 725PaLMS; cone and plate rheometer, Haake PK 100, 2 deg cone, 25 deg C
Casson viscosity15 to 55Pa sCone and plate rheometer, Haake PK 100, 2 deg cone, 25 deg C
Typical heat cure90 to 120seconds150 deg C after adhesive reaches cure temperature
Isothermal DSC conversion95 to 100%LMS; 5 minutes at 125 deg C
Technical properties

After-processing / final-state properties

Bulk and SMD bond-test values use different cure schedules; each row retains its applicable condition.

PropertyValueUnitMethod / condition
Thermal expansion coefficient52 x 10^-6K^-1ISO 11359-2; cured 30 minutes at 150 deg C
Thermal conductivity0.3W/(m K)ISO 8302; cured 30 minutes at 150 deg C
Density1.4g/cm^3BS 5350-B1; 25 deg C; cured 30 minutes at 150 deg C
Glass transition temperature155deg CASTM D 4065; cured 30 minutes at 150 deg C
Dielectric constant / dissipation factor3.1 / 0.02DimensionlessIEC 60250; 1 kHz; cured 30 minutes at 150 deg C
Volume resistivity1.8 x 10^15ohm cmIEC 60093; cured 30 minutes at 150 deg C
Dielectric breakdown strength40.1kV/mmIEC 60243-1; cured 30 minutes at 150 deg C
Torque strength30 to 70N mmIPC SM817, TM-650 2.4.42; C-1206 on bare FR4; cured 5 minutes at 125 deg C

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