LOCTITE 3129

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LOCTITE 3129

Main features

  • Low-Temperature 80 deg C Cure
  • Extended 21-Day Pot Life
  • Heat-Sensitive Electronics Bonding

Product Description

LOCTITE 3129 is a one-part black epoxy adhesive formulated for low-temperature heat cure in heat-sensitive electronics assembly. A recommended 5 to 10 minute cure at 80 deg C provides a short thermal process option, while pot life exceeds 21 days at 25 deg C. The uncured material has shear-dependent viscosity of 46,000 mPa s at 2 s^-1 and 12,000 mPa s at 20 s^-1. After 30 minutes at 80 deg C, the cured epoxy has a tensile strength of 36.4 MPa and develops 15.4 N/mm^2 lap shear strength on epoxy-glass by ISO 4587. Applications include memory cards and CCD/CMOS assemblies.

Key features

  • Low-temperature heat cure: The recommended cure schedule is 5 to 10 minutes at 80 deg C for heat-sensitive component assembly.
  • Extended pot life: Pot life exceeds 21 days at 25 deg C.
  • Electronics bond strength: Lap shear strength is 15.4 N/mm^2 on epoxy-glass after 30 minutes at 80 deg C by ISO 4587.

Applications

Applications include bonding heat-sensitive electronic components in memory cards and CCD/CMOS assemblies.

Product Family

LOCTITE 3129

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Black
Chemistry Type
Epoxy
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
>21 days
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.52
Physical Properties
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
46,000 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
35 °C
Other Properties
Storage Temperature
-15 °C to -25 °C

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
AppearanceBlackUncured material
Specific gravity1.52At 25 deg C
Viscosity46,000mPa s (cP)Haake PK100; cone PK1; 2 deg; 2 s^-1; 25 deg C
Viscosity12,000mPa s (cP)Haake PK100; cone PK1; 2 deg; 20 s^-1; 25 deg C
Casson viscosity4,200mPa s (cP)Haake PK100; cone PK1; 2 deg; 25 deg C
Yield point39,000mPa sAt 25 deg C
Pot life>21daysAt 25 deg C
Technical properties

After-processing / final-state properties

Cured-material properties use 30 minutes at 80 deg C.

PropertyValueUnitMethod / condition
CTE alpha 147K^-1ISO 11359-2
CTE alpha 2145K^-1ISO 11359-2
Glass transition temperature35deg CDMA
Storage modulus5.4GPaDMA; at 25 deg C
Tensile modulus2,000MPaTypical cured material
Tensile strength36.4MPaTypical cured material
Lap shear strength15.4N/mm^2ISO 4587; epoxy-glass

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