LAIRD TPUTTY 508
Harmonization Code : 3907.30.00.15 | Epoxide resin, halogen-free
Main features
- One-Part Automated Dispensing
- Vertical Gap-Filler Stability
- 3.7 W/(m K) Thermal Transfer
Product Description
Tputty 508 is a one-part ceramic-filled silicone dispensable gap filler for variable thermal interfaces. It combines typical thermal conductivity of 3.7 W/(m K) with a minimum bondline thickness of 0.09 mm and typical density of 3.2 g/cc. The green material is developed for automation and vertical stability, with a typical flow rate of 50 g/min using a 75 cc taper tip, 0.125 in orifice, and 90 psi. Syringe, cartridge, and pail configurations support different dispensing volumes. The product operates across -40 to 200 deg C.
Key features
- Automated dispensing: The one-part material is developed for automated application.
- Vertical stability: The dispensable gap filler is developed for stable application in varied orientations.
- Thermal transfer: Typical thermal conductivity is 3.7 W/(m K) by Hot Disk testing.
Applications
Applications include automotive electronics, drones and satellites, gaming systems, notebooks and tablets, servers, smart-home devices, and wireless infrastructure.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Values shown apply to Tputty 508, not the higher-flow Tputty 508MF variant.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 3.7 | W/(m K) | Typical; Hot Disk |
| Flow rate | 50 | g/min | Typical; 75 cc taper tip, 0.125 in orifice, 90 psi |
| Density | 3.2 | g/cc | Typical; helium pycnometer |
| Temperature range | -40 to 200 | deg C | Laird test method |
| Minimum bondline thickness | 0.09 | mm | Laird test method A16112-00 |
| Volume resistivity | 1 x 10^13 | ohm cm | ASTM D257 |
| Shelf life | 6 | months | As supplied |
| Outgassing TML | 0.04 | weight % | ASTM E595 |
