LAIRD TPLI220FG

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

LAIRD TPLI220FG

Main features

  • Fiberglass-Reinforced Thin Interface
  • 6.0 W/(m K) Thermal Transfer
  • Electrically Insulating Gap Filling

Product Description

Tpli 220FG is a fiberglass-reinforced 0.020 in (0.51 mm) silicone thermal gap filler grade in Laird's Tpli 200 family. Reinforcement distinguishes it from the unreinforced Tpli 220 configuration while retaining the family's typical 6.0 W/(m K) thermal conductivity. The boron nitride-filled sheet has Shore 00 hardness of 70, density of 1.4 g/cc, and volume resistivity of 5 x 10^13 ohm cm. Adhesive treatment and sheet dimensions vary by configuration, and the material carries the family's -45 to 200 deg C temperature range.

Key features

  • Fiberglass reinforcement: The 0.020 in grade uses fiberglass reinforcement.
  • Thermal conductivity: Typical thermal conductivity is 6.0 W/(m K) by ASTM D5470.
  • Electrical insulation: Typical volume resistivity is 5 x 10^13 ohm cm by ASTM D257.

Applications

Applications include automotive electronics, drones and satellites, gaming systems, instrumentation, portable devices, smart-home devices, and wireless infrastructure.

Technical Specifications

General Properties
Density (g)
1.4 g/cm3
Thermal Properties
Temperature Range
-45°C to 200 °C
Thermal Conductivity
6.0 W/m.K
Electrical Properties
Volume Resistivity
5x10¹³ Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Grade construction and thickness are product-specific; remaining values are typical for the Tpli 200 family.

PropertyValueUnitMethod / condition
Grade thickness0.020in0.51 mm; configuration varies by part number
ReinforcementFiberglass-Tpli 220FG grade construction
Thermal conductivity6.0W/(m K)Typical; ASTM D5470
Density1.4g/ccTypical; helium pycnometer
Hardness70Shore 00Typical; ASTM D2240
Volume resistivity5 x 10^13ohm cmTypical; ASTM D257
Temperature range-45 to 200deg CTpli 200 family range

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