LAIRD TPLI2160
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 0.160-Inch Gap Accommodation
- 6.0 W/(m K) Thermal Path
- Configurable Adhesive and Sheet Formats
Product Description
Tpli 2160 is a 0.160 in grade in Laird's Tpli 200 family of boron nitride-filled silicone thermal gap fillers. The compliant sheet has a typical thermal conductivity of 6.0 W/(m K), Shore 00 hardness of 70, and density of 1.4 g/cc. Typical volume resistivity is 5 x 10^13 ohm cm, and the family temperature range is -45 to 200 deg C. Adhesive treatment and sheet dimensions vary by configuration, so Tpli 1350remains a configurable grade rather than a single fixed part size.
Key features
- Thick gap-filler grade: The Tpli 2160 grade is 0.160 in thick.
- Thermal conductivity: Typical thermal conductivity is 6.0 W/(m K) by ASTM D5470.
- Configuration options: A0 and A1 formats provide no adhesive or adhesive on one side.
Applications
Applications include automotive electronics, drones and satellites, gaming systems, instrumentation, portable devices, smart-home devices, and wireless infrastructure.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Grade thickness is product-specific; remaining values are typical for the Tpli 200 family.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Grade thickness | 0.160 | in | Configuration varies by part number |
| Thermal conductivity | 6.0 | W/(m K) | Typical; ASTM D5470 |
| Density | 1.4 | g/cc | Typical; helium pycnometer |
| Hardness | 70 | Shore 00 | Typical; ASTM D2240 |
| Volume resistivity | 5 x 10^13 | ohm cm | Typical; ASTM D257 |
| Temperature range | -45 to 200 | deg C | Tpli 200 family range |
