LAIRD TPLI210FG
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Fiberglass-Reinforced Thin Profile
- 6.0 W/(m K) Thermal Conductivity
- Selectable A0 And A1 Configurations
Product Description
Tpli 210FG is the 0.010 in (0.25 mm) fiberglass-reinforced grade in Laird's Tpli 200 silicone thermal gap-filler series. It combines 6.0 W/(m K) thermal conductivity with Shore 00 hardness of 70 in a thin, electrically insulating sheet. Laird lists separate A0 and A1 adhesive configurations, allowing the exact construction to be selected for the assembly process. The boron nitride-filled material operates from -45 to 200 deg C and carries a UL 94 HB rating. Exact A0 pressure data provide thermal-resistance and deflection values for screening installed interface behavior.
Key features
- Fiberglass-reinforced profile: Thin reinforced construction supports handling at 0.010 in thickness.
- 6.0 W/(m K) performance: Provides measured thermal conductivity for gap-filling interfaces.
- A0 and A1 options: Separate adhesive configurations support assembly-specific selection.
Applications
Automotive ADAS; Automotive Electronics; Automotive Infotainment; Automotive Powertrain/ECUs; Drones/Satellites; Gaming Systems; Instrumentation; Notebooks/Tablets/Portable Devices; Routers; Smart Home Devices; Wireless infrastructure
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Fiberglass-reinforced boron nitride-filled silicone sheet | Exact Tpli 210FG grade and Tpli 200 datasheet | |
| Nominal thickness | 0.25 (0.010) | mm (in) | Exact Tpli 210FG part pages |
| Adhesive configuration | A0 or A1 | Separate Laird part configurations | |
| Density | 1.40 | g/cc | Helium pycnometer |
| Hardness | 70 | Shore 00 | ASTM D2240 |
| Outgassing | TML 0.46; CVCM 0.15 | % | ASTM E595 |
After-processing / final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 6.0 | W/(m K) | ASTM D5470 |
| Thermal resistance | 0.58 | deg C in^2/W | A0 configuration; 10 psi |
| Thermal resistance | 0.25 | deg C in^2/W | A0 configuration; 30 psi |
| Thermal resistance | 0.19 | deg C in^2/W | A0 configuration; 50 psi |
| Operating temperature range | -45 to 200 | deg C | Laird Tpli 200 datasheet |
| Dielectric constant | 3.20 | 10 GHz; ASTM D150 | |
| Volume resistivity | 5 x 10^13 | ohm-cm | ASTM D257 |
| UL flammability rating | HB | UL 94 |
