LAIRD TFLEX SF620
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Non-Silicone Thermal Interface
- 3.0 W/(m K) Thermal Conductivity
- 20 Mil Compact Profile
Product Description
Tflex SF620 is the 0.020 in (0.51 mm) grade in Laird's Tflex SF600 non-silicone gap-filler series. The boron nitride-filled sheet provides 3.0 W/(m K) thermal conductivity for silicone-sensitive electronics while retaining a naturally tacky surface on both sides. Its preformed construction supports placement without dispensing, and Shore 00 hardness of 80 provides a firmer interface than very soft silicone gap fillers. The material operates from -20 to 125 deg C and includes dielectric and volume-resistivity data. A UL 94 V-0 rating supports material screening for compact thermal assemblies.
Key features
- Non-silicone formulation: Supports thermal interfaces in silicone-sensitive electronics.
- 20 mil thin profile: Nominal 0.020 in thickness fits compact interface gaps.
- Naturally tacky surfaces: Both sides support placement without a separate adhesive layer.
Applications
Automotive ADAS; Automotive Electronics; Automotive Infotainment; Automotive Powertrain/ECUs; Drones/Satellites; Gaming Systems; Instrumentation; Notebooks/Tablets/Portable Devices; Routers; Smart Home Devices; Solid State Drives; Wireless infrastructure
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Boron nitride-filled non-silicone sheet | Laird Tflex SF600 datasheet | |
| Nominal thickness | 0.51 (0.020) | mm (in) | Tflex SF620 grade |
| Color | Rose | Visual | |
| Density | 1.27 | g/cc | Helium pycnometer |
| Hardness | 80 | Shore 00 | ASTM D2240 |
| Surface | Naturally tacky on both sides | Exact product family |
After-processing / final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 3.0 | W/(m K) | ASTM D5470 |
| Operating temperature range | -20 to 125 | deg C | Laird test |
| Thermal resistance | 0.81 | deg C in^2/W | 40 mil test thickness; 10 psi; 50 deg C; modified ASTM D5470 |
| Dielectric constant | 3.5 | 10 GHz; ASTM D150 | |
| Volume resistivity | 1 x 10^14 | ohm-cm | ASTM D257 |
| UL flammability rating | V-0 | UL 94 |
