LAIRD TFLEX HR480
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 80-Mil Tolerance Bridging
- Recovery Through Device Rework
- Adhesive-Free Placement Tack
Product Description
Tflex HR480 is the nominal 0.080 in thickness grade in the Tflex HR400 family of dark-grey silicone thermal gap fillers. Its low-modulus construction follows component topography and relieves mechanical stress from stack-up tolerances. The pad is naturally tacky on both sides, holding its position during assembly and transport without an added adhesive layer. Recovery after compression maintains mechanical integrity when devices are reworked and reassembled. With 1.8 W/(m K) thermal conductivity, 1.93 g/cm^3 density, Shore 00 hardness of 53, and a -50 to 160 deg C temperature range, the 80 mil grade provides a compliant, rework-oriented thermal interface.
Key features
- 80 mil compliant grade: Provides a nominal 0.080 in low-modulus interface.
- Recovery after compression: Maintains mechanical integrity during rework and reassembly.
- Adhesive-free placement tack: Holds the pad during assembly and component transport.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-Supplied Properties
Grade-specific nominal thickness; remaining values are typical for the Tflex HR400 material family.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Nominal thickness | 0.080 | in | Part-number convention |
| Thickness tolerance | +/- 10 | % | Nominal |
| Construction and composition | Ceramic-filled silicone sheet | Composition | |
| Color | Dark grey | Visual | |
| Density | 1.93 | g/cm^3 | Helium pycnometer |
| Hardness | 53 | Shore 00 | ASTM D2240 |
| Surface tack | Tacky on both sides | As supplied |
Installed Interface Properties
Typical Tflex HR400 material-family properties; thermal resistance is measured at 40 mil and 10 psi.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 1.8 | W/(m K) | ASTM D5470 |
| Thermal resistance | 1.00 | deg C in^2/W | ASTM D5470 (modified); 40 mil, 10 psi |
| Temperature range | -50 to 160 | deg C | Laird test method |
| Dielectric constant | 4.81 | ASTM D150; 1 MHz | |
| Volume resistivity | 2 x 10^13 | ohm-cm | ASTM D257 |
| UL flammability rating | V-0 | UL 94 |
