LAIRD TFLEX HD91250
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 7.5 W/(m K) Thermal Transfer
- Low-Outgassing Thermal Interface
- 1250-um Thickness Precision
Product Description
Tflex HD91250 is a grey, high-deflection silicone thermal gap filler supplied as a 9 x 9 in sheet with a nominal 1250 um (0.050 in) thickness. The Tflex HD90000 material delivers 7.5 W/(m K) thermal conductivity with low pressure-versus-deflection behavior and surface wetting that reduces contact resistance and component stress. Low outgassing includes 0.17% TML and 0.01% CVCM by ASTM E595. With Shore 00 hardness of 32 and a -65 to 125 deg C temperature range, this grade fits thermal interfaces for automotive electronics, satellites, instrumentation, gaming systems, routers, and wireless infrastructure.
Key features
- 1250 um sheet grade: Combines a nominal 0.050 in thickness with a 9 x 9 in format.
- 7.5 W/(m K) conductivity: Creates a high-conductivity path across thermal interface gaps.
- Low-outgassing construction: Measures 0.17% TML and 0.01% CVCM by ASTM E595.
Applications
Automotive ADAS; automotive electronics; automotive infotainment; automotive powertrain/ECUs; drones and satellites; gaming systems; instrumentation; notebooks, tablets, and portable devices; routers; smart-home devices; wireless infrastructure.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-Supplied Properties
Grade-specific nominal thickness and sheet size; remaining values are typical for the Tflex HD90000 material family.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Nominal thickness | 1250 | um | Part-number convention; 0.050 in |
| Thickness tolerance | +/- 10 | % | Nominal |
| Construction and composition | Ceramic-filled silicone sheet | Composition | |
| Color | Grey | Visual | |
| Density | 3.5 | g/cm^3 | Helium pycnometer |
| Hardness | 32 | Shore 00 | ASTM D2240 |
| Sheet size | 9 x 9 | in | Exact grade format |
Installed Interface Properties
Typical Tflex HD90000 material-family properties; thermal resistance is measured at 40 mil, 10 psi, and 50 deg C.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 7.5 | W/(m K) | Hot Disk |
| Thermal resistance | 0.198 | deg C in^2/W | ASTM D5470; 40 mil, 10 psi, 50 deg C |
| Temperature range | -65 to 125 | deg C | Laird test method |
| Dielectric constant | 8.14 | ASTM D150; 1 MHz | |
| Volume resistivity | 8.73 x 10^13 | ohm-cm | ASTM D257 |
| UL flammability rating | V-0 | UL 94 |
