LAIRD TFLEX HD760
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Reduced Component-Load Conformance
- 5.0 W/(m K) Heat Transfer
- 0.060-Inch Gap-Filler Grade
Product Description
Tflex HD760 is a nominal 0.060 in high-deflection thermal gap filler from the Tflex HD700 series. The ceramic-filled silicone sheet pairs 5.0 W/(m K) thermal conductivity with low pressure-versus-deflection behavior, creating a conformable thermal interface that minimizes mechanical stress on boards and components. Its surface wetting lowers contact resistance, while typical family properties include 3.3 g/cm^3 density, Shore 00 hardness of 54, and a -50 to 200 deg C temperature range. This 60 mil grade serves thermal interfaces in automotive electronics, instrumentation, portable devices, routers, smart-home products, and wireless infrastructure.
Key features
- 60 mil gap filler: Matches a nominal 0.060 in interface thickness.
- Conformable heat path: Pairs low-pressure deflection with 5.0 W/(m K) conductivity.
- Reduced interface stress: Limits mechanical loading on boards and components.
Applications
Automotive ADAS; automotive electronics; automotive infotainment; automotive powertrain/ECUs; drones and satellites; gaming systems; instrumentation; notebooks, tablets, and portable devices; routers; smart-home devices; wireless infrastructure.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-Supplied Properties
Grade-specific nominal thickness; remaining values are typical for the Tflex HD700 material family.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Nominal thickness | 0.060 | in | Part-number convention |
| Thickness tolerance | +/- 10 | % | Nominal |
| Construction and composition | Ceramic-filled silicone sheet | Composition | |
| Color | Pink | Visual | |
| Density | 3.3 | g/cm^3 | Helium pycnometer |
| Hardness | 54 | Shore 00 | ASTM D2240 |
Installed Interface Properties
Typical Tflex HD700 material-family properties; thermal resistance is measured at 40 mil and 10 psi.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 5.0 | W/(m K) | ASTM D5470 |
| Thermal resistance | 0.287 | deg C in^2/W | ASTM D5470 (modified); 40 mil, 10 psi |
| Temperature range | -50 to 200 | deg C | Laird test method |
| Dielectric constant | 5.01 | ASTM D150; 1 MHz | |
| Volume resistivity | 1.4 x 10^14 | ohm-cm | ASTM D257 |
| UL flammability rating | V-0 | UL 94 |
