LAIRD TFLEX HD730
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Thin 0.030-Inch Gap Control
- 5.0 W/(m K) Thermal Path
- Low-Pressure Component Interface
Product Description
Tflex HD730 is a 0.030 in Tflex HD700 thermal gap-filler grade for thin, compliant interfaces. The pink ceramic-filled silicone sheet provides 5.0 W/(m K) thermal conductivity and low pressure-versus-deflection characteristics, reducing mechanical stress as it conforms between heat-generating components and mating surfaces. Surface wetting contributes to low contact resistance, and the material has a Shore 00 hardness of 54 with a -50 to 200 deg C temperature range. This 30 mil format applies to thermal management in automotive electronics, gaming systems, instrumentation, notebooks and tablets, smart-home devices, and wireless infrastructure.
Key features
- Thin 30 mil format: Fits nominal 0.030 in thermal interface gaps.
- Conductive silicone path: Provides 5.0 W/(m K) thermal conductivity.
- Component-friendly deflection: Conforms at low pressure to reduce mechanical stress.
Applications
Automotive ADAS; automotive electronics; automotive infotainment; automotive powertrain/ECUs; drones and satellites; gaming systems; instrumentation; notebooks, tablets, and portable devices; routers; smart-home devices; wireless infrastructure.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-Supplied Properties
Grade-specific nominal thickness; remaining values are typical for the Tflex HD700 material family.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Nominal thickness | 0.030 | in | Part-number convention |
| Thickness tolerance | +/- 10 | % | Nominal |
| Construction and composition | Ceramic-filled silicone sheet | Composition | |
| Color | Pink | Visual | |
| Density | 3.3 | g/cm^3 | Helium pycnometer |
| Hardness | 54 | Shore 00 | ASTM D2240 |
Installed Interface Properties
Typical Tflex HD700 material-family properties; thermal resistance is measured at 40 mil and 10 psi.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 5.0 | W/(m K) | ASTM D5470 |
| Thermal resistance | 0.287 | deg C in^2/W | ASTM D5470 (modified); 40 mil, 10 psi |
| Temperature range | -50 to 200 | deg C | Laird test method |
| Dielectric constant | 5.01 | ASTM D150; 1 MHz | |
| Volume resistivity | 1.4 x 10^14 | ohm-cm | ASTM D257 |
| UL flammability rating | V-0 | UL 94 |
