LAIRD TFLEX B240

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

LAIRD TFLEX B240

Main features

  • 0.040-Inch Preformed Gap Control
  • 2 W/(m K) Interface Heat Transfer
  • High-Resistivity Electrical Insulation

Product Description

Tflex B240 is the 0.040 in (1000 um) thickness grade in the ceramic-filled silicone Tflex B200 thermal gap-filler family. The compliant, low-modulus pad combines typical 2.0 W/(m K) thermal conductivity with natural tack on both sides for placement during assembly. Typical Shore 00 hardness is 42, and typical volume resistivity is 2 x 10^13 ohm cm. Standard, center-fiberglass MFG, and one-side FG configurations extend the family's handling options, while a -40 to 150 deg C temperature range supports electronic thermal-interface use.

Key features

  • 1000-um thickness: 0.040 in (1000 um) preformed sheet.
  • Thermal conductivity: Typical 2.0 W/(m K) conductivity carries heat across the interface.
  • Electrical insulation: Typical volume resistivity is 2 x 10^13 ohm cm.

Applications

Applications include automotive ADAS, automotive infotainment, instrumentation, routers, and wireless infrastructure.

Technical Specifications

General Properties
Color
Grey
Density (g)
2.2 g/cm3
Thickness range
1 - 5 mm
Thermal Properties
Temperature Range
-400C to 150 °C
Thermal Conductivity
2.0 W/m.K
Electrical Properties
Volume Resistivity
2 x 10¹³ Ohms⋅cm

Additional Information

Technical properties

As-supplied properties

Typical Tflex B200 family data for the Tflex B240 thickness grade.

PropertyValueUnitMethod / condition
ConstructionCeramic-filled silicone sheet-Typical family construction
Nominal thickness0.040 (1000)in (um)Tflex B240 grade
ColorGray-Visual
Density2.2g/cm^3Typical; helium pycnometer
Hardness42Shore 00Typical; ASTM D2240, 3-second reading
Technical properties

Installed / in-service properties

Typical Tflex B200 family data for the Tflex B240 thickness grade. Thermal resistance is measured at 1.0 mm, not the nominal grade thickness.

PropertyValueUnitMethod / condition
Thermal conductivity2.0W/(m K)Typical; ASTM D5470
Thermal resistance1.10deg C in^2/WASTM D5470; 1.0 mm, 10 psi, 50 deg C
Temperature range-40 to 150deg CLaird test method
Volume resistivity2 x 10^13ohm cmTypical; ASTM D257
Flammability ratingV-0-UL 94

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