LAIRD TFLEX 760
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 0.060-Inch Preformed Gap Control
- Low-Pressure Thermal Resistance
- Naturally Tacky Interface Placement
Product Description
Tflex 760 combines a 0.060 in (1.52 mm) nominal thickness with the thermal and handling characteristics of the Tflex 700 silicone gap-filler family. Typical thermal conductivity is 5.0 W/(m K), while the compliant sheet conforms to component topography and maintains low thermal resistance at low pressure. The dark gray material is naturally tacky for placement during assembly and transport, so no added adhesive coating is required. Electrical insulation and a -40 to 200 deg C operating range complete the preformed interface profile.
Key features
- 60-mil sheet: 0.060 in (1.52 mm) preformed thermal interface.
- Low-pressure resistance: Compliant material retains low thermal resistance at low pressure.
- Natural tack: Tacky surfaces support placement without an added adhesive coating.
Applications
Applications include automotive electronics, automotive powertrain and ECUs, gaming systems, smart home devices, and wireless infrastructure.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
As-supplied properties
Typical Tflex 700 family data for the Tflex 760 thickness grade.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Filled silicone sheet | - | Typical family construction |
| Nominal thickness | 0.060 (1.52) | in (mm) | Tflex 760 grade |
| Color | Dark gray | - | Visual |
| Density | 1.70 | g/cm^3 | Typical |
| Shelf life | 2 | years | From date of shipment |
Installed / in-service properties
Typical Tflex 700 family data for the Tflex 760 thickness grade.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 5.0 | W/(m K) | Typical; Hot Disk |
| Operating temperature | -40 to 200 | deg C | Range |
| Dielectric constant | 7.80 | - | Typical |
| Volume resistivity | 1.00 x 10^13 | ohm cm | Typical |
| Flammability rating | V-0 | - | UL 94 |
