LAIRD TFLEX 560
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 0.060-Inch Gap-Filler Format
- 2.8 W/(m K) Thermal Transfer
- Naturally Tacky Adhesive-Free Placement
Product Description
Tflex 560 is a nominal 0.060 in grade of the Tflex 500 family, using a filled-silicone elastomer construction for thermal gap filling. Its preliminary typical thermal conductivity is 2.8 W/(m K), with Shore 00 hardness of 40 and a density of 3.0 g/cm^3. The compliant interface conforms with minimal pressure to limit stress on mating parts, while natural tack allows assembly without an additional adhesive coating. The material is electrically insulating and has a -50 to 200 deg C temperature range. Applications include chassis cooling, telecommunications hardware, power electronics, graphics cards, industrial automation equipment, and wireless infrastructure.
Key features
- 0.060 in sheet format: The Tflex 500 grade code defines a nominal 0.060 in thickness.
- Low-pressure conformity: Shore 00 hardness of 40 allows the sheet to conform with minimal pressure.
- Natural placement tack: The surface is naturally tacky and requires no additional adhesive coating.
Applications
Cooling components to chassis; power electronics; computer servers; graphics cards; industrial automation equipment; wireless infrastructure; automotive engine control.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Tflex 560 is the nominal 0.060 in Tflex 500 grade; other values are preliminary typical data for Tflex 500 material.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Filled silicone elastomer | - | As supplied |
| Color | Light blue | - | Visual; preliminary typical |
| Nominal thickness | 0.060 | in | Grade code; thickness in mils |
| Thickness tolerance | +/-10 | % | Standard thicknesses |
| Density | 3.0 | g/cm^3 | Helium pycnometer; preliminary typical |
| Hardness | 40 | Shore 00 | ASTM D2240; 3-second delay; preliminary typical |
After-processing / final-state properties
Preliminary typical material properties for the Tflex 500 family; thermal conductivity is a bulk value, not complete installed-interface performance.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 2.8 | W/(m K) | ASTM D5470; preliminary typical |
| Temperature range | -50 to 200 | deg C | Preliminary typical |
| Volume resistivity | 10^13 | ohm cm | ASTM D257; preliminary typical |
| Outgassing TML | 0.29 | % | ASTM E595; preliminary typical |
| Outgassing CVCM | 0.04 | % | ASTM E595; preliminary typical |
| Coefficient of thermal expansion | 37.4 | ppm/deg C | IPC-TM-650 2.4.24; 70 to 130 deg C; preliminary typical |
