LAIRD TFLEX 340
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 40 Mil Low-Pressure Thermal Resistance
- High-Compliancy Interface Coverage
- Reusable Low-Compression-Set Pad
Product Description
Tflex 340 is a 1.02 mm preformed silicone thermal gap filler from the Tflex 300 series. The 40 mil grade pairs typical 1.2 W/(m K) thermal conductivity with 0.98 deg C in^2/W thermal resistance at 10 psi and 50 deg C for a 40 mil specimen. Its compliant construction deflects more than 50% at 50 psi, while low compression set allows the pad to be reused. The light-green material operates from -40 to 160 deg C.
Key features
- 40 mil thermal data: Matches the 0.98 deg C in^2/W test thickness at 10 psi and 50 deg C.
- High compliance: Deflects more than 50% of its original thickness at 50 psi.
- Low compression set: Allows repeated pad placement and reuse.
Applications
Applications include automotive ADAS and electronics, gaming systems, instrumentation, notebooks and tablets, routers and wireless infrastructure.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Values describe the supplied preformed sheet before installation.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction and composition | Ceramic-filled silicone sheet | Typical | |
| Color | Light green | Visual | |
| Nominal thickness | 1.02 | mm | Exact grade |
| Density | 1.78 | g/cm^3 | Helium pycnometer |
| Hardness | 25.2 | Shore 00 | 40 mil and thicker; ASTM D2240 |
| Shelf life | 2 | years | From date of shipment |
After-processing / final-state properties
Values describe bulk or compressed material under the stated test conditions, not complete assembly performance.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Deflection | More than 50 | % | At 50 psi; relative to original thickness |
| Thermal conductivity | 1.2 | W/(m K) | ASTM D5470; typical |
| Thermal resistance | 0.98 | deg C in^2/W | 40 mil specimen; 10 psi; 50 deg C; ASTM D5470 modified |
| Operating temperature | -40 to 160 | deg C | Typical range |
| Dielectric constant | 4.5 | At 10 GHz; ASTM D150 | |
| Volume resistivity | 10^13 | ohm cm | ASTM D257 |
