LAIRD TFLEX 320FG
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Thin 0.51 mm Reinforced Interface
- 20 Mil Thickness-Specific Hardness
- Low-Compression-Set Pad Reuse
Product Description
Tflex 320FG is a 0.51 mm fiberglass-reinforced silicone thermal gap-filler sheet in the Tflex 300 series. Its thin preformed construction combines typical 1.2 W/(m K) thermal conductivity with a -40 to 160 deg C operating range. Shore 00 hardness is 51.4 for 20 to 30 mil material, matching this 20 mil grade thickness. High compliance and low compression set characterize the series for interface contact and repeated placement. Shelf life is two years from the date of shipment.
Key features
- Thin reinforced format: Combines a 0.51 mm sheet with fiberglass reinforcement.
- Thickness-specific hardness: Shore 00 hardness is 51.4 for 20 to 30 mil material.
- Thermal conductivity: Typical conductivity is 1.2 W/(m K) by ASTM D5470.
Applications
Applications include automotive electronics, drones and satellites, gaming systems, instrumentation, portable devices, routers and smart-home devices.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Values describe the supplied preformed sheet before installation.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction and composition | Ceramic-filled silicone sheet | Typical | |
| Color | Light green | Visual | |
| Nominal thickness | 0.51 | mm | Exact grade |
| Density | 1.78 | g/cm^3 | Helium pycnometer |
| Hardness | 51.4 | Shore 00 | 20 to 30 mil; ASTM D2240 |
| Shelf life | 2 | years | From date of shipment |
After-processing / final-state properties
Values describe bulk or compressed material under the stated test conditions, not complete assembly performance.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Deflection | More than 50 | % | At 50 psi; relative to original thickness |
| Thermal conductivity | 1.2 | W/(m K) | ASTM D5470; typical |
| Operating temperature | -40 to 160 | deg C | Typical range |
| Dielectric constant | 4.5 | At 10 GHz; ASTM D150 | |
| Volume resistivity | 10^13 | ohm cm | ASTM D257 |
