LAIRD TFLEX 3160
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 4.06 mm Gap-Filling Format
- Over-50% Compressive Deflection
- Low-Pressure Thermal Transfer
Product Description
Tflex 3160 uses a 4.06 mm preformed silicone sheet to provide compliant thermal gap filling around electronic components. The ceramic-filled material has typical 1.2 W/(m K) thermal conductivity and deflects more than 50% of its original thickness at 50 psi. Its 25.2 Shore 00 hardness for 40 mil and thicker material combines with low compression set for repeatable pad use. The light-green grade operates across a -40 to 160 deg C temperature range.
Key features
- 4.06 mm grade thickness: Provides the exact 4.06 mm preformed sheet dimension.
- Compressive deflection: Deflects more than 50% at 50 psi for conforming contact.
- Low compression set: Allows the pad to be reused across repeated placement cycles.
Applications
Suitable applications include automotive powertrain electronics, drones and satellites, instrumentation, notebooks and tablets, smart-home devices and wireless infrastructure.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Values describe the supplied preformed sheet before installation.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction and composition | Ceramic-filled silicone sheet | Typical | |
| Color | Light green | Visual | |
| Nominal thickness | 4.06 | mm | Exact grade |
| Density | 1.78 | g/cm^3 | Helium pycnometer |
| Hardness | 25.2 | Shore 00 | 40 mil and thicker; ASTM D2240 |
| Shelf life | 2 | years | From date of shipment |
After-processing / final-state properties
Values describe bulk or compressed material under the stated test conditions, not complete assembly performance.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Deflection | More than 50 | % | At 50 psi; relative to original thickness |
| Thermal conductivity | 1.2 | W/(m K) | ASTM D5470; typical |
| Operating temperature | -40 to 160 | deg C | Typical range |
| Dielectric constant | 4.5 | At 10 GHz; ASTM D150 | |
| Volume resistivity | 10^13 | ohm cm | ASTM D257 |
