KANEKA GR6842
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- High-Modulus Wet-Lamination Performance
- Six-Hour 180 deg F Cure
- Thick-to-Thin Composite Part Production
Product Description
Kaneka GR6842 is a high-modulus epoxy composite resin grade for wet lamination of thick and thin parts. Initial viscosity is 800 cP at 77 deg F, and the cure schedule is 6 hours at 180 deg F. Cured-system data include a 190 deg F (88 deg C) glass transition temperature, 152 MPa flexural strength, and 3.6 GPa flexural modulus. The resin combines a defined wet-lamination process with higher cured modulus for composite production across varied part thicknesses. This product is the epoxy resin grade only; a curing agent is not included.
Key features
- High cured modulus: Cured-system flexural modulus is 3.6 GPa.
- Defined lamination cure: The cure schedule is 6 hours at 180 deg F.
- Thick and thin parts: The wet-lamination resin is used for thick and thin composite parts.
Applications
Wet lamination of thick and thin composite parts.
TDS, SDS & Technical Documents
Technical Specifications
Physical Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Values are product-selection data for the resin grade and are not specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Resin type | Epoxy | As supplied | |
| Initial viscosity | 800 | cP | 77 deg F |
| Cure schedule | 6 | h | 180 deg F |
After-processing / final-state properties
Values describe cured-system performance and are product-selection data, not specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Glass transition temperature | 190 (88) | deg F (deg C) | Cured system |
| Flexural strength | 152 | MPa | Cured system |
| Flexural modulus | 3.6 | GPa | Cured system |
