HUMISEAL 2E42T-B

Harmonization Code : 8473.30.80.00 | Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472 ; Parts and accessories of the machines of heading 8471 ; Other; Other

HUMISEAL 2E42T-B

Main features

  • Thermally Conductive Electronic Encapsulation
  • Extended 60-Minute Pot Life
  • Simple 1:1 System Mixing

Product Description

HumiSeal 2E42T-B combines electronic protection with a thermally conductive two-component epoxy potting format. Typical component viscosities are 20,000 cP for Part A and 30,000 cP for Part B. At a typical 100 g mixed volume, pot life is 60 minutes and handling time is 180 minutes. Once cured, the black epoxy provides 0.83 W/(m K) thermal conductivity, 500 V/mil dielectric strength, Shore D65 hardness, and a typical operating-temperature range of -50 to 155 deg C. It is used for electronic and industrial encapsulation.

Key features

  • Thermal conductivity: Cured thermal conductivity is typically 0.83 W/(m K).
  • Dielectric strength: The cured epoxy has a typical dielectric strength of 500 V/mil.
  • 60-minute pot life: Typical pot life is 60 minutes at a 100 g mixed volume.

Applications

Electronic and industrial encapsulation.

Product Family

HUMISEAL 2E42T-B

Loading pricing…

Technical Specifications

General Properties
Mix Ratio
1:1
Pot Life
60 minutes
Thermal Properties
Operating Temperature
-50 to 155 °C

Additional Information

Technical properties

As-supplied / before-processing properties

Values are typical product-selection data and are not specifications. Pot-life and handling-time values use a typical 100 g volume.

PropertyValueUnitMethod / condition
Viscosity20,000cPPart A; typical
Viscosity30,000cPPart B; typical
Mix ratio1:1Part A:Part B; basis not stated
Pot life60minTypical 100 g mixed volume
Handling time180minTypical 100 g mixed volume
Technical properties

After-processing / final-state properties

Final-state values describe material after the typical 24 h room-temperature or 2 h at 65 deg C full cure. Cure time may vary with volume or mix ratio. Values are not specifications.

PropertyValueUnitMethod / condition
ColorBlackCured material
HardnessD65Shore DCured material; typical
Operating temperature-50 to 155deg CCured material; typical range
Thermal conductivity0.83W/(m K)Cured material; typical
Dielectric strength500V/milCured material; typical

Leading Brands Trust in Our Products and Services

Products that Perform| Knowledge that Serves| Service that Delivers