ELANTAS FR-1830
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- 2,200 cP Initial Mixed Viscosity
- Non-Abrasive Mineral Filler
- UL94 V-0 at 6.3 mm
Product Description
CONAPOXY FR-1830 is a two-component, mineral-filled, flame-retardant epoxy potting compound for electronic components and assemblies. Part A resin and Part B hardener mix at 100:20 by weight or 100:33 by volume. At 25 deg C, typical mixed values are 2,200 cP initially and a 50-minute work life. The system can be processed by hand, meter-mix, or vacuum potting and cures at room or elevated temperature. Its non-abrasive filler is specified to reduce equipment wear. Typical cured properties include UL94 V-0 at 6.3 mm, 0.1% linear shrinkage, and electrical insulation properties.
Key features
- Initial Mixed Viscosity: Typical mixed viscosity is 2,200 cP at 25 deg C, with a 50-minute work life under the stated conditions.
- Non-Abrasive Mineral Filler: The filler is specified to reduce wear on processing equipment.
- UL94 V-0 at 6.3 mm: Typical cured properties also include 510 volts/mil dielectric strength at 25 deg C on a 1/16-inch specimen.
Applications
Potting and encapsulation of electronic components; modules; printed circuit boards; assemblies; related devices.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical Part A, Part B, and mixed-system values at 25 deg C unless noted.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Part A viscosity | 14,000 | cP | Typical; 25 deg C |
| Part B viscosity | 85 | cP | Typical; 25 deg C |
| Part A specific gravity | 1.59 | - | Typical; 25 deg C |
| Part B specific gravity | 0.97 | - | Typical; 25 deg C |
| Mix ratio | 100:20 | parts by weight | Part A:Part B |
| Mix ratio | 100:33 | parts by volume | Part A:Part B |
| Initial mixed viscosity | 2,200 | cP | Typical; 25 deg C |
| Work life | 50 | minutes | Typical; 150 g at 25 deg C to 100,000 cP |
After-processing / final-state properties
Typical cured-system values; cure schedule is 24 to 36 hours at 25 deg C or 3 to 4 hours at 60 deg C.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Shore hardness | D 80 | - | ASTM D2240; 25 deg C |
| Tensile strength | 5,200 | psi | ASTM D412; 25 deg C |
| Linear shrinkage | 0.1 | % | ASTM D2566; 25 deg C |
| Moisture absorption | 0.3 | % | ASTM D570; 24 hours at 25 deg C |
| Dielectric strength | 510 | volts/mil | ASTM D149; 25 deg C; 1/16-inch specimen |
| Volume resistivity | 6.9 x 10^14 | ohm cm | ASTM D257; 25 deg C |
| Flammability | V-0 | - | UL94; 6.3 mm |
| Thermal conductivity | 0.5 | W/(m K) | ASTM D5930 |
