ECCOBOND UF3800
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 375 mPa s Viscosity at 25 deg C
- Cure Time of at Least 8 Minutes at 130 deg C
- CSP/BGA Underfill Rework Procedure
Product Description
LOCTITE ECCOBOND UF 3800 is a one-part black heat-cure epoxy underfill for CSP and BGA packages. The material flows at room temperature and has a typical viscosity of 375 mPa s at 25 deg C with a 3-day pot life. Henkel lists a cure schedule of at least 8 minutes at a 130 deg C bondline/material temperature. After cure, typical Tg is 69 deg C and storage modulus is 3.08 GPa at 25 deg C. The underfill is reworkable, with a specified procedure that heats the part to 240 deg C or higher before component removal and residue cleanup.
Key features
- 375 mPa s Viscosity at 25 deg C: Measured at 100 s^-1 shear rate for the room-temperature-flow underfill.
- At Least 8-Minute Cure at 130 deg C: The listed schedule is based on actual bondline/material temperature.
- At Least 240 deg C Rework Heating: The procedure heats the part before component removal and residue cleanup.
Applications
Underfilling CSP and BGA packages where room-temperature flow and a defined rework procedure are required.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Viscosity | 375 | mPa s | Physica MCR100; CP50-1; 100 s^-1; 25 deg C; typical |
| Specific gravity | 1.13 | - | Typical |
| Pot life | 3 | days | 25 deg C; typical |
| Shelf life | 274 | days | -20 deg C; typical |
After-processing / final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Tg | 69 | deg C | TMA; cured; typical |
| Storage modulus | 3.08 | GPa | 25 deg C; cured; typical |
| CTE below Tg | 52 | ppm/deg C | Cured; typical |
| CTE above Tg | 188 | ppm/deg C | Cured; typical |
| Dielectric constant | 2.97 | - | 1 GHz; 23 deg C; cured; typical |
| Dissipation factor | 0.0174 | - | 1 GHz; 23 deg C; cured; typical |
