ECCOBOND FP0097
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Less Than 2 ppm Extractable Chloride
- 25 um Maximum Filler Size
- 20,000 mPa s Viscosity
Product Description
LOCTITE ECCOBOND FP0097 is a one-part, black heat-cure epoxy encapsulant for semiconductor packages requiring high purity, low ionic content, moisture resistance, and high flow. Typical uncured viscosity is 20,000 mPa s at 25 deg C, with a 4-day pot life, 11-minute gel time at 121 deg C, and 274-day shelf life at -40 deg C. The recommended cure is 30 minutes at 125 deg C followed by 90 minutes at 165 deg C. After cure, the material has a typical Tg of 149 deg C and 11,500 N/mm^2 flexural modulus, with extractable chloride below 2 ppm and sodium below 1 ppm. The encapsulant is used in semiconductor and fine-wire-pitch package applications.
Key features
- Below 2 ppm Extractable Chloride: Cured extractable sodium is also below 1 ppm.
- 25 um Maximum Filler Size: The product is documented for fine-wire-pitch applications.
- 20,000 mPa s Viscosity at 25 deg C: Typical uncured value is measured by Brookfield RVF with spindle 6 at 20 rpm.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Viscosity | 20,000 | mPa s | Brookfield RVF, spindle 6, 20 rpm, 25 deg C; typical |
| Filler content | 73 | % | Ignition; typical |
| Pot life | 4 | days | 25 deg C; time to double viscosity; typical |
| Gel time | 11 | min | 121 deg C; typical |
| Shelf life | 274 | days | -40 deg C; typical |
| Recommended cure | 30 min + 90 min | - | 125 deg C followed by 165 deg C; guideline |
| Substrate temperature | 90 | deg C | Recommended processing temperature |
After-processing / final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| CTE below Tg | 21 | ppm/deg C | 40 to 120 deg C; typical |
| CTE above Tg | 72 | ppm/deg C | 190 to 220 deg C; typical |
| Glass transition temperature | 149 | deg C | Typical |
| Extractable chloride | <2 | ppm | Cured material; typical |
| Extractable sodium | <1 | ppm | Cured material; typical |
| Flexural strength | 113 | N/mm^2 | Typical |
| Flexural modulus | 11,500 | N/mm^2 | Typical |
