DOWSIL TC-4529

Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other

DOWSIL TC-4529

Main features

  • One-Part Non-Curing Gap Filler
  • Vertical-Position Retention
  • Dispensable Thermal Gap Filling

Product Description

Dow Corning TC-4529 Thermal Gap Filler is a one-part, gray, non-curing thermal gap filler for dispensable thermal management in electronic assemblies. The material is designed to hold on vertical surfaces while providing a thermal-transfer path across filled gaps. Because it remains non-curing, application does not require component mixing or a cure schedule. Its dispensable format supports placement in gaps and on non-horizontal surfaces while the material remains in position. Applications include automotive and electronic thermal management where a non-curing, dispensable gap-filling material is required.

Key features

  • No-Mix, No-Cure Installation: One-part thermal gap filler is supplied for direct placement without a cure step.
  • Vertical-Hold Gap Filler: The formulation is designed to remain in position on vertical surfaces.
  • Dispensable Thermal Gap Filling: The material forms a thermal-transfer interface across filled assembly gaps.

Applications

Automotive and electronic thermal management requiring a non-curing, dispensable gap filler.

Product Family

DOWSIL TC-4529

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Color
The color
Grey
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
3.1
Physical Properties
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
2
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
300000 mPa.s
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
3.2 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
6.3 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
3.1E+13 Ohms⋅cm

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