DOWSIL TC-4040

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

DOWSIL TC-4040

Main features

  • 4.0 W/(m K) Thermal Conductivity
  • Cure in Less Than 5 Minutes at 120 deg C
  • 60 um Minimum Bond Line

Product Description

DOWSIL TC-4040 Dispensable Thermal Pad is a two-part, blue, thermally conductive dispensable thermal pad for filling gaps between electronic components and heat-transfer surfaces. The system can be dispensed or printed by manual or automated processes and has a typical 3-hour working time at 25 deg C. Cure is available at room temperature or can be accelerated to less than 5 minutes at 120 deg C. The cured pad has a typical thermal conductivity of 4.0 W/(m K), Shore 00 hardness of 60, and minimum bond-line thickness of 60 um. It is used as a thermal interface and gap-filling material where heat dissipation is required.

Key features

  • 4.0 W/(m K) Thermal Conductivity: Typical thermal-conductivity value applies to the cured dispensable pad.
  • Less Than 5-Minute Cure at 120 deg C: Alternative schedules are 60 minutes at 80 deg C and 24 hours at 25 deg C.
  • Around 60 um Minimum Bondline: Documented minimum bond-line guidance applies to the dispensable thermal pad.

Applications

Thermal interface and gap filling where heat dissipation is required.

Product Family

DOWSIL TC-4040

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two Part (A/B)
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
3.2
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
66 %
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
4.0 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
10.2 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
3.95E+13 Ohms⋅cm

Additional Information

Technical properties

As-supplied component properties

PropertyValueUnitMethod / condition
Viscosity, Part A320,000cPASTM D1084; typical
Viscosity, Part B350,000cPASTM D1084; typical
Extrusion rate, mixed350g/minASTM D2452; 90 psi; typical
Specific gravity3.2-Uncured; ASTM D1475; typical
Technical properties

Cured thermal pad properties

PropertyValueUnitMethod / condition
Hardness60Shore 00ASTM D2240; typical
Thermal conductivity4.0W/(m K)ASTM F433 Hot Disk; typical
Minimum bond-line thickness60umTypical
Dielectric strength10.2kV/mmASTM D149; typical
Volume resistivity3.95E13ohm*cmASTM D1169; typical

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