DOWSIL EE-9000

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

DOWSIL EE-9000

Main features

  • 130-Minute Pot Life at 25 deg C
  • 23 kV/mm Dielectric Strength
  • 0.2 W/(m K) Thermal Conductivity

Product Description

DOWSIL EE-9000 Primerless RTV Encapsulant is a two-part, white, flowable polydimethylsiloxane encapsulant for protecting PCB and electrical assemblies. The system uses a 10:1 mix ratio, with typical Part A viscosity of 3,600 cP and mixed viscosity of 2,600 cP. Pot life is 130 minutes at 25 deg C. The mixed material cures at room temperature to a flexible elastomer and requires no post-cure. Typical properties include Shore A 16 hardness, 23 kV/mm dielectric strength, and 0.2 W/(m K) thermal conductivity. The primerless grade requires good cleaning but no additional priming step for adhesion.

Key features

  • Two-part mix ratio: The two-part system uses a 10:1 mix ratio; the ratio basis is not specified.
  • Room-temperature pot life: Typical pot life is 130 minutes at 25 deg C.
  • Dielectric strength: Typical dielectric strength is 23 kV/mm.

Applications

Protection and encapsulation of printed circuit boards and electrical/electronic assemblies.

Product Family

DOWSIL EE-9000

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Color
The color
White
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two Part (A/B)
Pot Life
Pot life is the amount of time it takes for the viscosity of a material to double (or quadruple for lower viscosity materials) in room temperature after a material is mixed. It is closely related to work life but it is not application dependent, less precise and more of a general indication of how fast a system is going to cure.
130 minutes
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.2 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
23 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
5E+15 Ohms⋅cm

Additional Information

Technical properties

Before-processing encapsulant properties

PropertyValueUnitMethod / condition
Mix ratio10:1Two-part system; basis not stated
Viscosity, Part A3,600cPTypical
Viscosity, mixed2,600cPTypical
Pot life130minTypical; at 25 deg C; time for viscosity to double after mixing
Technical properties

Cured encapsulant properties

PropertyValueUnitMethod / condition
Thermal conductivity0.2W/(m K)Typical
Durometer16Shore ATypical
Dielectric strength23kV/mmTypical
Volume resistivity5 x 10^15ohm cmTypical
Dissipation factor0.002Typical; 1 MHz; JIS K 6249
Dielectric constant3.2Typical; 1 MHz; JIS K 6249

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