COOLTHERM SC-6754
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 0.5 W/(m K) Thermal Conductivity
- Nil Bleed After 24 Hours at 200 deg C
- -55 to +205 deg C Continuous Service
Product Description
CoolTherm SC-6754 Silicone Grease is a one-component, white, non-curing silicone thermal grease for semiconductor-to-heat-sink interfaces. Typical viscosity is 500,000 cP at 25 deg C, with thermal conductivity of 0.5 W/(m K). Typical electrical properties include volume resistivity of 1 x 10^14 ohm-cm at 25 deg C and dielectric strength of 300 V/mil. After 24 hours at 200 deg C, typical bleed is nil and weight loss is 0.6%. The continuous operating-temperature range is -55 to +205 deg C.
Key features
- Thermal conductivity: Typical thermal conductivity is 0.5 W/(m K).
- High-temperature bleed behavior: Typical bleed is nil after 24 hours at 200 deg C, with 0.6% weight loss.
- Continuous operating range: The continuous operating-temperature range is -55 to +205 deg C.
Applications
Thermal interface between semiconductors and heat sinks; non-curing shock-resistant sealing at the same interface.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / in-service grease properties
SC-6754 is a non-curing grease, so the same material remains at the installed interface rather than forming a separate cured state.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | White paste | Typical | |
| Viscosity | 500,000 | cP | Typical; 25 deg C |
| Specific gravity | 2.3 | Typical | |
| Bleed | Nil | % | Typical; 24 hours at 200 deg C |
| Weight loss | 0.6 | % | Typical; 24 hours at 200 deg C |
| Thermal conductivity | 0.5 | W/(m K) | Typical |
| Volume resistivity | 1 x 10^14 | ohm-cm | Typical; 25 deg C |
| Dielectric strength | 300 | V/mil | Typical |