COOLTHERM SC-3500

Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other

COOLTHERM SC-3500

Main features

  • 3.5 W/(m K) Thermal Conductivity
  • <100 ppm Cyclic Siloxane Content
  • 1:1 Weight or Volume Mixing

Product Description

CoolTherm SC-3500 Thermally Conductive Silicone Gap Filler is a two-part, low-volatility silicone gap filler for thermal management in electronic assemblies and power components. Resin and hardener mix 1:1 by weight or volume for handheld cartridge or automatic meter/mix/dispense application. Typical working time is 60 minutes at 25 deg C, with cure schedules of 24 hours at 25 deg C or 60 minutes at 80 deg C. Typical cured thermal conductivity is 3.5 W/(m K) with 80 Shore OO hardness. Cyclic siloxane content is below 100 ppm.

Key features

  • Cured thermal conductivity: Typical cured thermal conductivity is 3.5 W/(m K) by ISO 22007-2.
  • Controlled cyclic siloxane content: Typical content is below 100 ppm as determined using ASTM F2466.
  • Equal-ratio mixing: Resin and hardener mix 1:1 by weight or volume.

Applications

Thermal gap filling in electronic assemblies and power components.

Product Family

COOLTHERM SC-3500

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Resin (A): Off-white Paste | Hardener (B): Pink Paste | Mixed: Light Pink Paste
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
A/B/Mixed: 3.3
Physical Properties
Viscosity (Part A)
114,000 mPa.s
Viscosity (Part B)
80,000 mPa.s
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
3.5 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
6.3 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
3.5 x 10^13 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Resin and hardener are supplied separately; mixed values apply after the 1:1 combination.

PropertyValueUnitMethod / condition
Mix ratio, resin:hardener1:1by weight or volumeBefore application
Viscosity, resin114,000cPTypical; 25 deg C; 10/sec shear rate
Viscosity, hardener80,000cPTypical; 25 deg C; 10/sec shear rate
Specific gravity, mixed3.3Typical; mixed material
Working time60minTypical; mixed material; 25 deg C; ASTM D4473-08
Shelf life, resin / hardener9 / 5monthsOriginal unopened containers; 5 to 30 deg C
Technical properties

Cured gap-filler properties

Typical cured values use a cure schedule of 24 hours at 25 deg C.

PropertyValueUnitMethod / condition
Thermal conductivity3.5W/(m K)Typical; Hot Disc Transient Method; ISO 22007-2
Hardness80Shore OOTypical; ASTM D2240; 10 sec dwell
Tensile strength0.23MPaTypical; ASTM D638
Elongation at break50%Typical; ASTM D638
Volume resistivity3.5 x 10^13ohm-cmTypical; ASTM D257; 25 deg C
Cyclic siloxane content<100ppmTypical; ASTM F2466

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