COOLTHERM ME-543

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

COOLTHERM ME-543

Main features

  • 21,000 cP Jet-Dispense Viscosity
  • 7 to 20 Minute Cure at 160 to 165 deg C
  • 260 deg C Peak Reflow Resistance

Product Description

CoolTherm ME-543 Underfill Encapsulant is a high-purity, anhydride-free, thermally conductive epoxy underfill for densely populated area-array flip-chip packages. Typical viscosity is 21,000 cP at 25 deg C for jet dispensing in corner-dot, line, or L-shaped patterns. A 100 deg C substrate preheat can reduce underfill time. Cure is 7 to 20 minutes at 160 to 165 deg C after the material reaches the target temperature. Typical cured thermal conductivity is 1.2 W/(m K), and the underfill is designed to withstand a 260 deg C peak reflow temperature associated with lead-free solder processing.

Key features

  • Jet-dispensing viscosity: Typical viscosity is 21,000 cP at 25 deg C for jet dispensing.
  • Elevated-temperature cure: Cure is 7 to 20 minutes at 160 to 165 deg C after the material reaches the target temperature.
  • Lead-free reflow resistance: The underfill is designed to withstand a 260 deg C peak reflow temperature associated with lead-free solder processing.

Applications

Underfill encapsulation of densely populated area-array flip-chip electronic packages.

Product Family

COOLTHERM ME-543

Loading pricing…
TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Black Liquid
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
2.2
Physical Properties
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
21,000 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
135 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
1.2 W/m.K
Chemical Properties
Moisture absorption
0.7 %
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
>1 x 10^15 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
AppearanceBlack liquidTypical; uncured
Viscosity21,000cPTypical; TA Rheometer; 25 deg C
Specific gravity2.2Typical; uncured
Gel time3minTypical; 150 deg C
Working life36hTypical; 25 deg C
Technical properties

Cured underfill properties

PropertyValueUnitMethod / condition
Thermal conductivity1.2W/(m K)Typical
CTE, alpha 127ppm/deg CTypical
CTE, alpha 295ppm/deg CTypical
Glass transition temperature135deg CTypical; TMA
Die shear strength62MPaTypical
Volume resistivity>1 x 10^15ohm-cmTypical; 25 deg C

Leading Brands Trust in Our Products and Services

Products that Perform| Knowledge that Serves| Service that Delivers