BOSTIK THERMELT 868
Harmonization Code : 3214.10.00 | Putty and other mastics | Resin cements, caulking compounds and other mastics
Main features
- UV- and Moisture-Resistant Encapsulation
- Low-Temperature Outdoor Encapsulation
- Clearest-Color Thermelt Grade
Product Description
Bostik Thermelt 868 is a UV- and moisture-resistant moldable polyamide hot melt resin for low-pressure encapsulation of electronic components and assemblies. The one-component grade is used for demanding outdoor applications and operates from -40 to 125 deg C. Shore D hardness is 30/20 measured immediately and after 15 seconds, while the softening point is 160 +/- 5 deg C. Thermelt 868 is also the clearest-color grade in the Thermelt range, combining outdoor exposure resistance with a distinct appearance option for low-pressure molded electronics.
Key features
- Outdoor resistance: Very good UV and moisture resistance is specified for demanding outdoor applications.
- Thermal range: The grade operates from -40 to 125 deg C with a 160 +/- 5 deg C softening point.
- Clearest-color grade: Thermelt 868 is the clearest-color product in the Thermelt molding range.
Applications
Low-pressure molding, encapsulation, and protection of electronic components and assemblies.
TDS, SDS & Technical Documents
Technical Specifications
Physical Properties
Thermal Properties
Mechanical Properties
Chemical Properties
Additional Information
Final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating range | -40 to 125 | deg C | Grade operating range |
| Shore hardness | 30 / 20 | D | ISO 868; instant / 15 s |
| Softening point | 160 +/- 5 | deg C | ASTM D3461 |