BOSTIK THERMELT 195
Harmonization Code : 3214.10.00 | Putty and other mastics | Resin cements, caulking compounds and other mastics
Main features
- High-Thermal-Stability Electronics Overmolding
- Increased-Hardness Molded Protection
- One-Component Low-Pressure Molding
Product Description
Bostik Thermelt 195 is a one-component polyamide hot melt resin for low-pressure molding and electronics overmolding. The grade combines a -20 to 150 deg C operating range with a 200 +/- 5 deg C softening point and Shore D hardness of 45/40 measured immediately and after 15 seconds. Its increased hardness and thermal stability distinguish it within the Thermelt molding range while retaining the low-pressure encapsulation format used for electronic assemblies. Applications include low-pressure molding, encapsulation, and protection of electronic components and assemblies where a moldable polyamide layer is required.
Key features
- High thermal range: The grade operates from -20 to 150 deg C and has a 200 +/- 5 deg C softening point.
- Increased hardness: Shore D hardness is 45/40 by ISO 868, measured immediately and after 15 seconds.
- Electronics overmolding: Moldable polyamide grade for low-pressure encapsulation and protection of electronic components and assemblies.
Applications
Low-pressure molding, encapsulation, and protection of electronic components and assemblies.
TDS, SDS & Technical Documents
Technical Specifications
Mechanical Properties
Electrical Properties
Additional Information
Final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating range | -20 to 150 | deg C | Grade operating range |
| Shore hardness | 45 / 40 | D | ISO 868; instant / 15 s |
| Softening point | 200 +/- 5 | deg C | ASTM D3461 |