BOSTIK SGH0005-03A
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Quick-Tack Assembly Fixturing
- Flexible Moisture-Cured Thermoset Bond
- Steel, Wood and Plastic Bonding
Product Description
Bostik Supergrip H0005-03A is a solvent-free, one-component moisture-curing urethane adhesive supplied as a solid reactive hot melt. It is applied at 110 to 120 deg C, then reacts with ambient moisture to form a cross-linked thermoset bond without additional heat for cure. A 4 to 7 minute open time and good green strength with quick tack support efficient assembly handling. The cured film reaches 3,700 psi tensile at break and 1,400% elongation at break after the specified seven-day cure. Applications include automotive speaker assembly and general product assembly to steel, wood, and selected plastics.
Key features
- Reactive Hot-Melt Processing: Solid adhesive is applied hot, then moisture cures to a cross-linked thermoset bond.
- Quick-Tack Assembly Handling: Good green strength and quick tack aid fixture handling during assembly.
- Flexible Multi-Substrate Bonding: The adhesive is used for flexible bonds to steel, wood, and selected plastics.
Applications
Automotive speaker assembly and general product assembly to steel, wood, and selected plastics.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Mechanical Properties
Additional Information
As-supplied and processing properties
One-component solid moisture-curing urethane adhesive before full cure.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Color | Opaque, Off-White | As supplied | |
| Total solids | 100 | % | As supplied |
| Viscosity | 7,000 | cP | At 120 deg C |
| Density | 1.10 | g/cm^3 | As supplied |
| Open time | 4 to 7 | min | 10 mil film at ambient conditions |
| Application temperature | 110 to 120 | deg C | Typical application range |
| Shelf life | 12 | months | 23 deg C; unopened factory-sealed container |
Final-state properties
Typical cured-film properties after 7 days at 25 deg C and 50% RH unless otherwise indicated.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Tensile at break | 3,700 | psi | Cured 7 days at 25 deg C and 50% RH |
| Elongation at break | 1,400 | % | Cured 7 days at 25 deg C and 50% RH |
| Water resistance | Good | Typical cured film | |
| Chemical resistance | Excellent | Typical cured film | |
| Heat resistance | 195 | deg C | Typical cured film |