ALPHA CNP CVP520
Harmonization Code : 3403.19 | Lubricating Preparations (With 70% or More Petroleum Oils) For Automotive and Other Uses
Main features
- Low-Temperature 155 to 190 deg C Reflow
- Extended 8-Hour Stencil Life
- Air or Nitrogen Reflow
Product Description
ALPHA CVP-520 Solder Paste is a low-melting-point, no-clean, lead-free solder paste for low-temperature surface-mount assembly. Available configurations include multiple Sn/Bi/Ag alloy options with Type 3, Type 4, or Type 5 powder. Low-temperature processing uses peak reflow profiles between 155 and 190 deg C, and stencil life is more than 8 hours at 23 deg C and 50% RH. The paste is compatible with clean-dry air or nitrogen reflow. In suitable assemblies with temperature-sensitive through-hole components, CVP-520 can eliminate an extra wave or selective soldering process step.
Key features
- Configurable paste: Available alloy configurations are paired with Type 3, Type 4, or Type 5 powder options.
- Extended stencil life: Stencil life is more than 8 hours at 23 deg C and 50% RH.
- Low-temperature reflow: Peak reflow profiles between 155 and 190 deg C can be run in clean-dry air or nitrogen.
Applications
Low-temperature surface-mount soldering and reflow assembly.
TDS, SDS & Technical Documents
Technical Specifications
Chemical Properties
Additional Information
As-supplied and process properties
CVP-520 is offered in multiple alloy and powder configurations; exact processing details depend on the selected configuration.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Alloy options | 42Sn/57.6Bi/0.4Ag; 42Sn/58Bi; 42Sn/57Bi/1.0Ag on request | Available configurations | |
| Powder types | Type 3, Type 4, Type 5 | Available configurations | |
| Stencil life | More than 8 | hours | 23 deg C; 50% RH |
| Refrigerated shelf life | 6 | months | 0 to 10 deg C |
| Stencil working temperature | 19 to 29 | deg C | Printing on stencil |
| Print speed | 40 to 100 | mm/sec | Standard and fine-pitch stencil printing |
| Peak reflow temperature | 155 to 190 | deg C | General effective range; configuration dependent |
| Reflow atmosphere | Air or N2 | Clean-dry air or nitrogen |
