ABLESTIK ECF506

Harmonization Code : 8529.90 | Parts solely or principally used for TV, radio, and transmission

ABLESTIK ECF506

Main features

  • Glass-Fabric Bondline Control
  • 24-Hour Work Life at 25 deg C
  • 125 deg C Thermal Rework

Product Description

LOCTITE ABLESTIK ECF 506 is a flexible, gray heat-cure epoxy film adhesive with a glass-fabric carrier for bonding materials with mismatched coefficients of thermal expansion in electronic assemblies. Typical cured properties include thermal conductivity of 1.0 W/(m K) at 121 deg C, electrical resistance of 0.005 ohm/0.5 sq in measured through joints, and aluminum-to-aluminum lap-shear strength of 1,000 psi at 25 deg C. Typical work life is 24 hours at 25 deg C. Recommended cure is 1 hour at 150 deg C, with alternatives of 1.5 hours at 125 deg C or 3 hours at 100 deg C. Bonded components can be reworked by heating the component to 125 deg C and sliding a thin blade between the bonded surfaces.

Key features

  • Glass-fabric bondline control: A glass-fabric carrier is combined with the film's specified uniform bondline-control characteristic.
  • 24-hour work life: Typical work life is 24 hours at 25 deg C.
  • 125 deg C thermal rework: Bonded components may be heated to 125 deg C and separated with a thin blade.

Applications

Electronic assembly bonding of materials with mismatched coefficients of thermal expansion.

Product Family

ABLESTIK ECF506

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
White
Film Thickness
Film thickness is the thickness of a backing film without taking into account any coatings or adhesive layers. It is measured in micron and the conversion factor to mil is 0.039.
0.0762 mm
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate. It is based on the change in viscosity and it can rely on the application requirements.
24 hours
Thermal Properties
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding. The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
3 °C
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.9 W/m.K
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
46.85 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
0.7×10¹³ Ohms⋅cm

Additional Information

Technical properties

As supplied

PropertyValueUnitMethod / condition
AppearanceGrayProduct characteristic
CarrierGlass fabricProduct characteristic
Work life24hoursTypical; 25 deg C
Shelf life183daysTypical; -40 deg C; from date of manufacture
Technical properties

Cured material

PropertyValueUnitMethod / condition
Glass transition temperature (Tg)2deg CTypical
Thermal conductivity1.0W/(m K)Typical; 121 deg C
Electrical resistance0.005ohm/0.5 sq inTypical; measured through joints
Lap shear strength1,000psiTypical; Al to Al; 25 deg C
Lap shear strength700psiTypical; Au to Au; 25 deg C

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