ABLESTIK 8177

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

ABLESTIK 8177

Main features

  • 4-Minute 130 deg C Cure
  • 3.0 W/(m K) Thermal Conductivity
  • 0.0001 ohm cm Volume Resistivity

Product Description

LOCTITE ABLESTIK 8177 is a one-component silver-filled heat-cure epoxy die-attach adhesive for chip attachment requiring thermal and electrical conductivity, including thermally sensitive devices. Typical cured thermal conductivity is 3.0 W/(m K), volume resistivity is 0.0001 ohm cm, and die-shear strength is 6,300 psi for silicon die bonded to silver at 25 deg C. For assembly, the adhesive has a typical 24-hour work life at 25 deg C and a recommended cure schedule of 4 minutes at 130 deg C. Typical viscosity is 12,000 cP at 25 deg C, measured with Brookfield CP51 at 5 rpm.

Key features

  • Thermal conductivity: Cured material has a typical thermal conductivity of 3.0 W/(m K).
  • Low volume resistivity: The typical cured value is 0.0001 ohm cm.
  • Si-to-Ag die shear: Typical die shear is 6,300 psi for silicon die to silver at 25 deg C.

Applications

Chip attach requiring high thermal conductivity, including thermally sensitive devices.

Product Family

ABLESTIK 8177

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Silver
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate. It is based on the change in viscosity and it can rely on the application requirements.
24 hours
Physical Properties
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
5.0
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
12,000 mPa.s
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
3.0 W/m.K
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
0.0001 Ohms⋅cm

Additional Information

Technical properties

As supplied

PropertyValueUnitMethod / condition
AppearanceSilverAs supplied
Thixotropic index5.00.5/5 rpm
Viscosity12,000cPBrookfield CP51; 25 deg C; 5 rpm
Specific gravity3.91As supplied
Work life24hours25 deg C
Shelf life365days-40 deg C
Technical properties

Cured material

PropertyValueUnitMethod / condition
Thermal conductivity3.0W/(m K)Typical cured material
Extractable chloride10ppm100 deg C
Extractable sodium5ppm100 deg C
Extractable potassium5ppm100 deg C
Volume resistivity0.0001ohm cmTypical cured material
Die shear6,300psiSilicon die to silver; 25 deg C

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